Effect of Si contents on microstructure and mechanical characteristics of TiAlSiN thin film deposited by HiPIMS using different TiSi target compositions
Chayan Ranjan Das, Mufaddal Rangwala, Amitava Ghosh
Abstract
High Power Impulse Magnetron Sputtering (HiPIMS) PVD deposition technology offers smoother coating enhanced mechanical properties and improved substrate-coating adhesion and has become a superior alternative to direct current magnetron sputtering (DCMS). The technology utilizes high peak power with a small pulse duration, leading to a much denser plasma in the order of 10 18 m −3 . This results in dense, defect-free, and high-quality smoother coatings. In this study, TiAlSiN coatings were deposited on WC-10Co (wt%) cermet using HiPIMS technology with two different Ti Si contents. A pair of Ti Si targets, either of compositions Ti77Si23 or of Ti66Si34, were used during the depositions along with another pair of Ti40Al60, in successive cathode-stages. The impact of Ti and Si atomic percentages on the microstructure and mechanical properties of the coatings was investigated using various techniques, including X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FESEM), transmission electron microscopy (TEM), 3D-surface profiling, nano-indentation, Rockwell indentation-adhesion, and scratch test. The coating's thickness and deposition rate were estimated from the cross-section morphology. The results suggested that the TiAlN phase likely existed in an amorphous phase of Si 3 N 4 in TiAlSiN coatings. As the Ti atomic percentage in the layer increased, the hardness improved, reaching up to 42 GPa (max). Additionally, the coating surface roughness decreased from 14.3 nm to 10.9 nm, and the grain size decreased from 10 nm to 9 nm. The adhesion strength observed under the Rockwell-indentation test was rated as HF1 in both cases. Furthermore, the indentation test revealed similar crack patterns, but an increase in Ti content significantly improved the coating-substrate adhesion, as confirmed by the Scratch test. The scratch test demonstrated a maximum load of 173 N during the complete delamination (Lc 3 ) of TiAlSiN from the carbide substrate.