Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling
Xiaoguang Huang, Yichao Wang, Qihui Zhu, Zhongzhe Du, Longchi Zhou, Hehe Liu
Topics & Concepts
Materials scienceCreepSolderingTemperature cyclingFinite element methodComposite materialSinteringMetallurgyThermalStructural engineeringPhysicsMeteorologyEngineeringAluminum Alloys Composites PropertiesElectronic Packaging and Soldering TechnologiesAdvanced ceramic materials synthesis