Investigation on the WC/Cu interfacial bonding properties: First-principles prediction and experimental verification
Zhenwei Liu, Aiqin Wang, Pei Liu, Jingpei Xie
Topics & Concepts
Materials scienceStackingHigh-resolution transmission electron microscopySurface energyTransmission electron microscopyCrystallographyCopperMetalCovalent bondWork (physics)Interface (matter)Composite materialMetallurgyThermodynamicsNanotechnologyWettingNuclear magnetic resonanceQuantum mechanicsSessile drop techniquePhysicsChemistryAdvanced materials and compositesAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesis