Adhesion, cavitation, and fibrillation during the debonding process of pressure sensitive adhesives
Stylianos Varchanis, A. Kordalis, Yannis Dimakopoulos, John Tsamopoulos
Abstract
Transient 3-dimensional simulations of viscoelastic fluidlike adhesives access the physics behind the debonding process of pressure sensitive adhesives (PSA). A novel finite element method is developed to simulate viscoelastic flows with multiple free surfaces and contact lines. The rheological properties of the adhesive are correlated with its tackiness and stickiness, targeting the development of materials with improved adhesive energy.
Topics & Concepts
AdhesiveViscoelasticityMaterials scienceRheologyPressure sensitiveCavitationComposite materialAdhesionFinite element methodTransient (computer programming)MechanicsLayer (electronics)Structural engineeringComputer scienceEngineeringOperating systemPhysicsRheology and Fluid Dynamics StudiesAdhesion, Friction, and Surface InteractionsFluid Dynamics and Heat Transfer