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Hf-Based and Zr-Based Charge Trapping Layer Engineering for E-Mode GaN MIS-HEMT Using Ferroelectric Charge Trap Gate Stack

Jui-Sheng Wu, Chih-Chieh Lee, Chia-Hsun Wu, Chengjun Huang, Yan-Kui Liang, You‐Chen Weng, Edward Yi Chang

2022IEEE Journal of the Electron Devices Society24 citationsDOIOpen Access PDF

Abstract

E-mode hybrid ferroelectric charge storage gate (FEG) GaN HEMTs have shown promising performances for future power GaN device applications. The FEG-HEMT demonstrates a combination of ferroelectric polarization and charge trapping process in the ferro-charge-storage gate stack, leading to a positive threshold voltage shift for E-mode operations. In this work, FEG-HEMTs with various Hf-based and Zr-based charge trapping layers are systematically studied. FEG-HEMT which employed nitrogen incorporated HfO2 (HfON) as the charge trapping layer shows an E-mode operation with the highest Vth (+2.3 V) after initialization. Moreover, the gate leakage of the HfON sample was further reduced due to the nitrogen incorporation, leading to a more complete charging process during initialization. The Vth instability is also addressed and investigated. The FEG-HEMT with HfON as the charge trapping layer showed a negligible Vth hysteresis (-43mV) and the highest Vth stability in both the PBTI (positive bias threshold voltage instability) and NBTI (negative bias threshold voltage instability) test measurements.

Topics & Concepts

Materials scienceHigh-electron-mobility transistorFerroelectricityOptoelectronicsThreshold voltageTrappingVoltageElectrical engineeringDielectricTransistorEcologyEngineeringBiologyGaN-based semiconductor devices and materialsSemiconductor materials and devicesZnO doping and properties
Hf-Based and Zr-Based Charge Trapping Layer Engineering for E-Mode GaN MIS-HEMT Using Ferroelectric Charge Trap Gate Stack | Litcius