Litcius/Paper detail

Thermal stability of microscale additively manufactured copper using pulsed electrodeposition

Soheil Daryadel, Majid Minary‐Jolandan

2020Materials Letters16 citationsDOI

Topics & Concepts

Microscale chemistryMaterials scienceCopperAnnealing (glass)Void (composites)Nanoscopic scaleComposite materialThermal stabilityElectronicsMetallurgyNanotechnologyChemical engineeringMathematicsMathematics educationPhysical chemistryEngineeringChemistryAdditive Manufacturing and 3D Printing TechnologiesAdditive Manufacturing Materials and ProcessesNanomaterials and Printing Technologies