Characterization of Prismatic Slip in SiC Crystals by Chemical Etching Method
Shanshan Hu, Shuai Fang, Yafei Liu, Qian Yu Cheng, Hong Peng, Ze Yu Chen, Yu Gao, Chao Gao, Balaji Raghothamachar, Michael Dudley
Abstract
In 4H-silicon carbide crystals, basal plane slip is the predominant deformation mechanism. However, prismatic slip is often observed in single crystals grown by the physical vapor transport method as the diameter expands to 6 inches or larger. Thermal modeling has shown that occurrence of prismatic slip is attributed to increased radial thermal gradients. While X-ray topography can be used to characterize the presence and extent of prismatic slip, the feasibility of using the chemical etching method to assess the extent of prismatic slip in an industrial setting is investigated. The distribution of scallop shaped etch pits oriented along the directions that correspond to prismatic dislocations, correlate well with the results of the thermal model that predicts the occurrence of prismatic slip dislocations. This capability of the etch pit method to characterize prismatic slip can be used to manage radial thermal gradients during PVT growth.