An efficient thin layer equivalent technique of SETD method for thermo-mechanical multi-physics analysis of electronic devices
Qi Qiang Liu, Mingwei Zhuang, Weichen Zhan, Na Liu, Qing Liu
Topics & Concepts
Reliability (semiconductor)ComputationCoaxialMaterials scienceElectronicsFinite element methodTransient (computer programming)Stress (linguistics)Electronic packagingElectronic componentComputer scienceElectronic engineeringMechanical engineeringElectrical engineeringPhysicsComposite materialAlgorithmPhilosophyThermodynamicsEngineeringLinguisticsQuantum mechanicsOperating systemPower (physics)TelecommunicationsSilicon Carbide Semiconductor TechnologiesElectromagnetic Simulation and Numerical MethodsElectrostatic Discharge in Electronics