Review of Hybrid Packaging Methods for Power Modules
Puqi Ning, Xiaoshuang Hui, Yuhui Kang, Tao Fan, Kai Wang, Yunhui Mei, Guangyin Lei
Abstract
The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules, respectively. The automatic layout method can improve the electrical and thermal performance of hybrid structures. A state-of-the-art hybrid structure is introduced, and suggestions for alleviating the current and temperature imbalances for future designs are provided.
Topics & Concepts
PlanarWire bondingPower (physics)Computer sciencePower moduleElectronic engineeringThermalElectrical engineeringEngineering drawingMechanical engineeringEngineeringPhysicsChipComputer graphics (images)MeteorologyQuantum mechanicsElectronic Packaging and Soldering TechnologiesElectromagnetic Compatibility and Noise Suppression3D IC and TSV technologies