Cu-Cu joining using citrate coated ultra-small nano-silver pastes
Shuye Zhang, Qian Wang, Tiesong Lin, Pengzhe Zhang, Peng He, Kyung‐Wook Paik
Topics & Concepts
Materials scienceSinteringNano-SolderingComposite materialFocused ion beamTransmission electron microscopyMetallurgyCopperNanoscopic scaleChemical engineeringNanotechnologyIonQuantum mechanicsEngineeringPhysicsElectronic Packaging and Soldering TechnologiesNanomaterials and Printing Technologies3D IC and TSV technologies