Material removal rate prediction in chemical mechanical planarization with conditional probabilistic autoencoder and stacking ensemble learning
Yupeng Wei, Dazhong Wu
Topics & Concepts
Chemical-mechanical planarizationAutoencoderArtificial intelligenceProbabilistic logicProcess (computing)Computer scienceSurface (topology)PolishingMachine learningAlgorithmPattern recognition (psychology)Materials scienceDeep learningEngineeringMathematicsMechanical engineeringOperating systemGeometryAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Measurement and Metrology Techniques