Crack control for efficient nanosecond-laser slicing of large-size 4H-SiC crystals
Xiangyu Yu, Wenxiao Wu, Bin Li, Xiangqian Xiu, Youdou Zheng, Rong Zhang
Topics & Concepts
SlicingNanosecondMaterials scienceLaserOptoelectronicsNanotechnologyComposite materialOpticsComputer sciencePhysicsComputer graphics (images)Silicon Carbide Semiconductor TechnologiesIntegrated Circuits and Semiconductor Failure AnalysisAdvanced Surface Polishing Techniques