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Multimode photoacoustic characterization of subsurface damage in ground thin wafers

Zaiwei Liu, Bin Lin, Xiaohu Liang, Xiaokang Ma, Yangfan Wan

2022International Journal of Mechanical Sciences14 citationsDOI

Topics & Concepts

Materials scienceLamb wavesWaferOpticsRayleigh waveMulti-mode optical fiberRayleigh scatteringUltrasonic sensorLaserPhotoacoustic effectGuided wave testingAcousticsSurface waveOptoelectronicsOptical fiberPhysicsUltrasonics and Acoustic Wave PropagationAdvanced Surface Polishing TechniquesNon-Destructive Testing Techniques
Multimode photoacoustic characterization of subsurface damage in ground thin wafers | Litcius