A universal and efficient equivalent modeling method for thermal analysis of 3D ICs containing tapered TSVs
Xixin Rao, Jianhao Song, Qing Tian, Huizhong Liu, Cheng Jin, Chengdi Xiao
Topics & Concepts
TaperingThermal conductivityMaterials scienceThree-dimensional integrated circuitIntegrated circuitThermalInterconnectionFinite element methodEquivalent circuitThermal resistanceHeat transferThermal analysisElectronic engineeringOptoelectronicsComputer scienceMechanicsComposite materialStructural engineeringElectrical engineeringThermodynamicsEngineeringPhysicsComputer graphics (images)VoltageComputer network3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering Technologies