Study on inhibition of interfacial compounds and improvement of joint properties by low temperature and high-pressure process in diffusion bonding of Ti/Cu
Yanni Wei, Yaru Li, Linghao Zhu, Yu Chen, Bingbing Guo
Topics & Concepts
IntermetallicDiffusion bondingMaterials scienceNucleationDiffusionBrittlenessAmorphous solidJoint (building)Shear strength (soil)Diffusion processAtmospheric temperature rangeLayer (electronics)MetallurgyComposite materialAlloyCrystallographyChemistryThermodynamicsSoil waterOrganic chemistryEnvironmental scienceArchitectural engineeringInnovation diffusionComputer scienceKnowledge managementEngineeringSoil sciencePhysicsAdvanced Welding Techniques AnalysisAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties