Numerical analysis of the strength and interfacial behaviour of adhesively bonded joints with varying bondline thicknesses
Wang Guo, Peijian Chen, Liyuan Yu, Guangjian Peng, Yucheng Zhao, Feng Gao
Topics & Concepts
Materials scienceAdhesiveComposite materialStructural engineeringFinite element methodLayer (electronics)EngineeringMechanical Behavior of CompositesEpoxy Resin Curing ProcessesStructural Load-Bearing Analysis