Surface characteristics and material removal mechanisms during nanogrinding on C-face and Si-face of 4H-SiC crystals: Experimental and molecular dynamics insights
Haoxiang Wang, Zhigang Dong, Renke Kang, Shang Gao
Topics & Concepts
NanoindentationMaterials scienceGrindingWaferSurface roughnessMachiningMolecular dynamicsDislocationCrystal (programming language)Composite materialSilicon carbideNanotechnologyMetallurgyComputer scienceChemistryComputational chemistryProgramming languageAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchMetal and Thin Film Mechanics