High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite
L. Lei, L. Bolzoni, Fei Yang
Topics & Concepts
Materials scienceDiamondComposite numberThermal conductivityComposite materialCopperLayer (electronics)Flexural strengthParticle (ecology)MetallurgyGeologyOceanographyAluminum Alloys Composites PropertiesThermal properties of materialsAdvanced ceramic materials synthesis