Enhancing interfacial heat conduction in diamond-reinforced copper composites with boron carbide interlayers for thermal management
Shuai Cui, Fangyuan Sun, Dazheng Wang, Xing Zhang, Hailong Zhang, Yanhui Feng
Topics & Concepts
Materials scienceComposite materialBoron carbideCopperDiamondThermal conductionThermalBoron nitrideBoronThermal management of electronic devices and systemsCarbideMetallurgyOrganic chemistryPhysicsChemistryEngineeringMeteorologyMechanical engineeringAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisThermal properties of materials