Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints
Xinmeng Zhai, Yuefeng Li, Jun Zou, Shi Mingming, Yang Bobo, Li Yang, Guo Chunfeng, Rongrong Hu
Topics & Concepts
SolderingMaterials scienceFlip chipComposite materialVoid (composites)Scanning electron microscopeShear strength (soil)Reflow solderingMetallurgyDirect shear testShear (geology)Layer (electronics)AdhesiveSoil waterSoil scienceEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis