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Two-stage Hall-Petch relationship in Cu with recrystallized structure

Yanzhong Tian, Yuping Ren, Si Gao, Ruixiao Zheng, J.H. Wang, Hucheng Pan, Z.F. Zhang, Nobuhiro Tsuji, Gaowu Qin

2020Journal of Material Science and Technology88 citationsDOI

Topics & Concepts

Grain boundary strengtheningGrain sizeMaterials scienceCondensed matter physicsAlloyDislocationGrain boundaryMetallurgyMicrostructurePhysicsComposite materialMicrostructure and mechanical propertiesMagnetic properties of thin filmsMicrostructure and Mechanical Properties of Steels
Two-stage Hall-Petch relationship in Cu with recrystallized structure | Litcius