A low cost multi-shapes designed sintering composite paste: A strengthening method of sintered interconnect for die attach in high temperature applications
Ke Li, Yang Liu, Jing Zhang, Nan Xiao
Topics & Concepts
Materials scienceSinteringComposite materialComposite numberMicrostructureBimetallic stripInterconnectionDie (integrated circuit)Particle (ecology)Shear strength (soil)MetallurgyNanotechnologySoil waterMetalComputer scienceOceanographySoil scienceComputer networkEnvironmental scienceGeologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties