Litcius/Paper detail

Ultrawide bandgap Al<i> <sub>x</sub> </i>Ga<sub>1–<i>x</i> </sub>N channel heterostructure field transistors with drain currents exceeding 1.3 A mm<sup>−1</sup>

Mikhail Gaevski, Shahab Mollah, Kamal Hussain, Joshua Letton, Abdullah Mamun, Mohi Uddin Jewel, M. V. S. Chandrashekhar, G. Simin, Asif Khan

2020Applied Physics Express21 citationsDOI

Abstract

We report an Ultrawide Bandgap Al0.4Ga0.6N channel metal-oxide-semiconductor heterostructure field effect transistor with drain currents exceeding 1.33 A mm−1 (pulse) and 1.17 A mm−1 (DC), around a 2-fold increase over past reports. This increase was achieved by incorporating a hybrid barrier layer consisting of an AlN spacer, n-doped Al0.6Ga0.4N barrier and a thin reverse graded AlxGa1–xN (x from 0.60 to 0.30) cap layer. To enhance current spreading, a "perforated" channel layout comprising of narrow channel sections separated by current blocking islands was used. A composite ALD deposited ZrO2/Al2O3 film was used as gate dielectric. A breakdown field above 2 MV cm−1 was measured.

Topics & Concepts

Materials scienceHeterojunctionOptoelectronicsBand gapField-effect transistorBarrier layerTransistorDopingAtomic layer depositionLayer (electronics)Electrical engineeringNanotechnologyVoltageEngineeringGaN-based semiconductor devices and materialsSemiconductor materials and devicesGa2O3 and related materials