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Corrosion behavior of immersion silver printed circuit board copper under a thin electrolyte layer

Hualiang Huang, Xiaomeng Guo, Furong Bu, Gangliang Huang

2020Engineering Failure Analysis30 citationsDOI

Topics & Concepts

Galvanic cellCorrosionMaterials scienceImmersion (mathematics)CopperElectrolyteGalvanic corrosionElectrochemistryMetallurgyCoatingPrinted circuit boardOpen-circuit voltageLayer (electronics)Galvanic anodeComposite materialElectrodeChemistryCathodic protectionElectrical engineeringVoltageEngineeringPure mathematicsMathematicsPhysical chemistryCorrosion Behavior and InhibitionElectrodeposition and Electroless CoatingsAnodic Oxide Films and Nanostructures
Corrosion behavior of immersion silver printed circuit board copper under a thin electrolyte layer | Litcius