Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
Sanjay Tikale, K. Narayan Prabhu
Topics & Concepts
Materials scienceIntermetallicSolderingMicrostructureComposite materialAlloyShear strength (soil)NanoparticleSolder pasteCeramicSubstrate (aquarium)NanocompositeMetallurgyIndentation hardnessLayer (electronics)NanotechnologyOceanographyGeologyEnvironmental scienceSoil scienceSoil waterElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies