Review of microstructure and properties of low temperature lead-free solder in electronic packaging
Kai‐Kai Xu, Liang Zhang, Lili Gao, Nan Jiang, Lei Zhang, Sujuan Zhong
Abstract
Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.
Topics & Concepts
MicrostructureSolderingMaterials scienceElectronic packagingWettingMetallurgyLead (geology)Composite materialGeologyGeomorphologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties