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Characterization of hot deformation behavior of Al0.3CoCrFeNi high-entropy alloy and development of processing map

Madan Patnamsetty, Sumit Ghosh, Mahesh C. Somani, Pasi Peura

2022Journal of Alloys and Compounds49 citationsDOIOpen Access PDF

Abstract

This study presents the characteristics of hot deformation behavior of a Al0.3CoCrFeNi high–entropy alloy in the temperature and strain rate ranges of 1023–1423 K and 10–3–10 s–1, respectively. The constitutive flow behavior was modeled based on the hyperbolic–sinusoidal Arrhenius–type equations and a mathematical relation was used to observe the influence of true strain on material constants. To define the hot workability of the alloy, a processing map was developed based on the principles of the dynamic materials model. Accordingly, a dynamic recrystallization (DRX) domain was identified as prudent for processing in the temperature and strain rate ranges of 1273–1423 K and 10–2–2 × 10–1 s–1 respectively, with a peak efficiency of ~45% at 1423 K/6 × 10–2 s–1. At lower temperatures (1048–1148 K) and strain rates (10–3–3 × 10–3 s–1), a dynamic recovery (DRV) domain was identified with a peak efficiency of 38% at 1123 K/10–3 s–1. A large instability regime occurred above 3 × 10–1 s–1 with an increased tendency of adiabatic shear bands. It extended to lower strain rates 10–2–10–1 s–1 at temperatures < 1123 K, manifested by localized shear bands and grain boundary cracking. At low strain rates (5 × 10–3–10–3 s–1) and temperatures (1148–1298 K), particle stimulated nucleation of new DRX grains occurred at B2 precipitates, though the efficiency of power dissipation dropped sharply to ∼9%.

Topics & Concepts

Dynamic recrystallizationStrain rateMaterials scienceNucleationThermodynamicsAdiabatic shear bandAlloyFlow stressGrain boundaryArrhenius equationDeformation (meteorology)MetallurgyHot workingComposite materialActivation energyMicrostructureChemistryPhysicsPhysical chemistryHigh Entropy Alloys StudiesAdvanced materials and compositesHigh-Temperature Coating Behaviors
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