Recent advances on SnBi low-temperature solder for electronic interconnections

Nan Jiang, Liang Zhang, Lili Gao, Xiaoguo Song, Peng He

2021Journal of Materials Science Materials in Electronics69 citationsDOI

Topics & Concepts

SolderingMaterials scienceCreepMelting pointMetallurgyWettingMicrostructureDuctility (Earth science)Electronic packagingComposite materialElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties