Litcius/Paper detail

Understanding the ISPP Slope in Charge Trap Flash Memory and its Impact on 3-D NAND Scaling

Devin Verreck, A. Arreghini, F. Schanovsky, G. Rzepa, Zlatan Stanojević, F. Mitterbauer, C. Kernstock, O. Baumgartner, M. Karner, G. Van den bosch, M. Rosmeulen

20212021 IEEE International Electron Devices Meeting (IEDM)32 citationsDOI

Abstract

We present a physical modeling approach that explains the non-ideal ISPP slope in charge trap layer (CTL) flash memory and its impact on 3-D NAND vertical pitch scaling. First, we derive an expression for the V <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf> change rate and use its field dependence to reproduce experimental vertical NAND ISPP slopes. Next, we implement a 2.5-D TCAD model based on these insights and show significant program voltage increase (>5V) in realistic 3-D NAND flash devices with scaling vertical pitch (down to 10nm). Finally, we evaluate high-k CTL and airgaps as mitigation measures at scaled pitch.

Topics & Concepts

NAND gateScalingFlash (photography)Trap (plumbing)CTL*Computer scienceLogic gateElectrical engineeringElectronic engineeringPhysicsAlgorithmEngineeringMathematicsChemistryOpticsIn vitroCytotoxic T cellGeometryBiochemistryMeteorologyAdvanced Data Storage TechnologiesThin-Film Transistor TechnologiesSemiconductor materials and devices