Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility
Dinh-Phuc Tran, Kuan‐Ju Chen, K. N. Tu, Chih Chen, Yao‐Tsung Chen, Stream Chung
Topics & Concepts
Materials scienceUltimate tensile strengthDuctility (Earth science)MicrostructureElectroplatingCopperDislocationSlip (aerodynamics)Composite materialMetallurgyLayer (electronics)CreepPhysicsThermodynamicsMicrostructure and mechanical propertiesElectrodeposition and Electroless CoatingsAluminum Alloys Composites Properties