Microfluidic-enabled three-dimensional stretchable thermoelectrics
Zhenlong Huang, Tao Chen, Yan Jiang, Rui Zhou, Yizhuo Wang, Junjie Ji, Hongwei Xie, Taisong Pan, Dongpeng Fan, Linlong Liang, Longpeng Yang, Binbin Jiang, Liming Peng, Min Gao, Jia Zhu, Guang Yao, Dongfeng Xue, Yuan Lin
Abstract
Stretchable electronics hold promise but remain limited to low‑power use due to poor heat dissipation. We present a three-dimensional (3D) integration strategy combining elastomeric material modification, 3D printing, and laser etching to fabricate stretchable thermoelectric devices (TEDs) with enhanced refrigeration capabilities. The device features a 3D architecture integrating embedded microfluidics with multilayer thermoelectric networks, providing improved heat exchange capacity suitable for high thermal design power (TDP) requirements. The device achieves ~10 °C environmental and 11 °C on-skin temperature reduction with precise control. Furthermore, by integrating a temperature sensor and control circuit with the 3D TED, a wearable closed-loop system is developed. Benefiting from the improved device performance and advanced control algorithms, this system enables accurate and rapid regulation of skin temperature, demonstrating potential applications in virtual temperature and pain sensation. The integration method proposed here may offer a generalizable approach for advancing high-power stretchable electronics, thereby broadening their range of applications.