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Charge Transport in Vertical GaN Schottky Barrier Diodes: A Refined Physical Model for Conductive Dislocations

Leilei Chen, Ning Jin, Dawei Yan, Yanrong Cao, Linna Zhao, Hailian Liang, Bin Liu, En Xia Zhang, Xiaofeng Gu, Ronald D. Schrimpf, Daniel M. Fleetwood, Hai Lu

2020IEEE Transactions on Electron Devices27 citationsDOI

Abstract

Charge transport mechanisms of forward and reverse leakage currents in vertical GaN Schottky barrier diodes are investigated by measuring the temperature-dependent current-voltage characteristics. The results show that the leakage current is primarily governed by dislocation-associated thermionic field emission (TFE). The primary transport path is the reduced, localized conduction band around the dislocation core rather than the continuum defect states. A refined phenomenological physical model is developed for conductive dislocations in GaN, emphasizing that: 1) surface donors, surrounding the core of dislocations, can significantly shrink the barrier region after ionization, causing severe TFE leakage; 2) the ON donors likely to be responsible for TFE have a typical density of ~1 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">18</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> at 300 K and activation energy of 78 meV; and 3) the barrier height at donor sites is ~0.65 eV at 300 K, which is reduced by ~0.4 eV with respect to the dislocation-free region.

Topics & Concepts

Thermionic emissionSchottky diodeSchottky barrierDislocationMaterials scienceDiodeCondensed matter physicsLeakage (economics)OptoelectronicsPhysicsElectronQuantum mechanicsMacroeconomicsEconomicsGaN-based semiconductor devices and materialsSemiconductor materials and interfacesSilicon Carbide Semiconductor Technologies
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