Experimental study on single-phase hybrid microchannel cooling using HFE-7100 for liquid-cooled chips
Min Yang, Mo-Tong Li, Yuchao Hua, Wei Wang, Bing Cao
Topics & Concepts
Heat sinkMaterials scienceMicrochannelPressure dropThermal resistanceHeat fluxThermodynamicsReynolds numberComputer coolingMechanicsHeat transferThermal management of electronic devices and systemsMechanical engineeringPhysicsNanotechnologyEngineeringTurbulenceHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies