11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
A.J. Smith, Eric Chapman, Chintan Patel, Raja Swaminathan, John Wuu, Tyrone Huang, Wonjun Jung, Alexander Kaganov, H. McIntyre, R. Mangaser
Abstract
The AMD Instinct™ MI 300 Series accelerators were conceptualized to extract maximum HPC and AI capability from the latest silicon and advanced packaging technology, designed to operate as CPU hosted PCle® device, MI300X, as well as a self-hosted accelerated processing unit (APU), MI300A. AMD chiplet capabilities and advanced packaging allow AMD’s first-ever integration of data center class CPU, GPU accelerated compute, AMD Infinity Cache, and 8-stack HBM3 memory system into a single package. Observing that many Al and HPC operators are memory bound, AMD targeted MI300 to deliver over 5TBps of HBM3 peak bandwidth.