Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity
S. Q. Jia, L. Bolzoni, Tong Li, Fei Yang
Topics & Concepts
DiamondMaterials scienceThermal conductivityCopperComposite numberGrain sizeMetallurgyCarbideComposite materialForgingMaterial properties of diamondAluminum Alloys Composites PropertiesAdvanced materials and compositesAdvanced ceramic materials synthesis