Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint
Gangli Yang, Xiaoyan Li, Erhua Ren, Shanshan Li
Topics & Concepts
IntermetallicMaterials scienceSolderingMorphology (biology)Joint (building)Crystal (programming language)Composite materialDiffusionStructural engineeringAlloyThermodynamicsBiologyPhysicsComputer scienceEngineeringGeneticsProgramming languageElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties