Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing
Jintao Zheng, Peiqi Ge, Wenbo Bi, Yukang Zhao, Chao Wang
Topics & Concepts
SlicingWaferMaterials scienceDiamondComposite materialSpan (engineering)Tension (geology)AdhesionElectroplatingOptoelectronicsUltimate tensile strengthMechanical engineeringStructural engineeringLayer (electronics)EngineeringAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisDiamond and Carbon-based Materials Research