Preparation of polyimide bond-linked covalent organic frameworks as resin-compatible nanofillers for copper clad laminates with improved thermal and electrical performances
He Sun, Cheng Wang, Xiao Zhang, Fengwei Wang
Topics & Concepts
PolyimideMaterials scienceCopperComposite materialCovalent bondThermalPolymerSolid mechanicsMetallurgyOrganic chemistryLayer (electronics)ChemistryMeteorologyPhysicsCovalent Organic Framework ApplicationsConducting polymers and applicationsAdvanced Photocatalysis Techniques