Top-down method to fabricate TiNi1+Sn half-Heusler alloy with high thermoelectric performance
Xiong Yang, Daquan Liu, Jian-Bo Li, Ruonan Min, Huijun Kang, Linwei Li, Zongning Chen, Enyu Guo, Tongmin Wang
Topics & Concepts
Materials scienceAlloyThermoelectric effectSeebeck coefficientThermal conductivityDimensionless quantityThermoelectric materialsImpurityGrain sizeFigure of meritElectrical resistivity and conductivityPhase (matter)OptoelectronicsCondensed matter physicsMetallurgyComposite materialThermodynamicsElectrical engineeringPhysicsChemistryOrganic chemistryEngineeringAdvanced Thermoelectric Materials and DevicesHeusler alloys: electronic and magnetic propertiesChalcogenide Semiconductor Thin Films