3-D Printing Structural Electronics With Conductive Filaments
Nathan Lazarus, Harvey Tsang
Abstract
Integrating electronics into the body of complex structural parts through 3-D printing is one of the most promising new technologies in additive manufacturing, giving the potential of lighter weight and smaller electronic systems. Although fused filament fabrication (FFF) is one of the cheapest and most widely available 3-D printing approaches available, FFF has lagged behind alternatives, such as direct write printing for incorporating electronics into 3-D printed parts. In this article, complex structural electronics are demonstrated using FFF. Numerous surface-mount components are integrated into the printing process for 3-D structures, and electrical contact is made using conductive thermoplastic filament with and without copper electroplating for improved conductivity. The electrical contact characteristics and bridging behavior of several commercially available filaments are investigated. A circuit demonstrator, a 555-timer oscillator circuit, is then printed using the process.