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Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux

Zixiao Gui, Xiaowu Hu, Xiongxin Jiang, Yulong Li, Haozhong Wang

2021Journal of Materials Science Materials in Electronics20 citationsDOI

Topics & Concepts

SolderingMaterials scienceWettingShear strength (soil)Composite materialJoint (building)IntermetallicMetallurgyDirect shear testShear (geology)Structural engineeringSoil scienceEngineeringEnvironmental scienceAlloySoil waterElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux | Litcius