Review on Coupled Thermo-Hydraulic Performance of Nanofluids and Microchannels
Yuwei Wang, Jie Yu, Cong Qi, Wenjie Zhang
Abstract
As electronic components continue to be miniaturized, the heat flux density continues to increase. Scholars have proposed the use of microchannel heat sinks (MCHS) to dissipate heat from devices with high heat flux density, and have pointed out that the heat dissipation capability of MCHS can be improved in two ways: using nanofluids with high thermal conductivity and optimizing the structure of MCHS. In this paper, the thermophysical parameters and thermo-hydraulic performance of nanofluids in microchannels are reviewed. Improving the heat dissipation of MCHS is analyzed and discussed in terms of both thermal properties and flow properties, respectively.
Topics & Concepts
NanofluidMicrochannelThermal conductivityThermal management of electronic devices and systemsHeat fluxMaterials scienceHeat sinkDissipationHigh heatThermalMechanicsFlow (mathematics)ThermodynamicsHeat transferMechanical engineeringNanotechnologyPhysicsEngineeringComposite materialHeat Transfer and OptimizationNanofluid Flow and Heat TransferHeat Transfer and Boiling Studies