Litcius/Paper detail

The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures

Yanpeng Gong, Yuguo Kou, Qiang Yue, Xiaoying Zhuang, Fei Qin, Qiao Wang, Timon Rabczuk

2024International Communications in Heat and Mass Transfer17 citationsDOI

Topics & Concepts

InterconnectionMaterials scienceElectronic packagingField (mathematics)Phase (matter)Integrated circuit packagingEngineering physicsMechanicsComputer scienceComposite materialOptoelectronicsIntegrated circuitPhysicsTelecommunicationsQuantum mechanicsMathematicsPure mathematicsNumerical methods in engineeringElectronic Packaging and Soldering TechnologiesComposite Material Mechanics
The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures | Litcius