Litcius/Paper detail

Mechanical Strength and Electrical Conductivity of Cu–In Solid Solution Alloy Wires

Yasunori Abe, Satoshi Semboshi, Naoya Masahashi, Sung Hwan Lim, Eun‐Ae Choi, Seung Zeon Han

2022Metallurgical and Materials Transactions A16 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceAlloyUltimate tensile strengthStacking-fault energyElectrical resistivity and conductivityMicrostructureAnnealing (glass)CopperMetallurgyComposite materialDeformation (meteorology)Solid solutionIndiumGrain sizeEngineeringElectrical engineeringAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesAluminum Alloy Microstructure Properties