Electroplated Ru and RuCo films as a copper diffusion barrier
Kuan Chen Wu, Jiun Yi Tseng, Wen Jauh Chen
Topics & Concepts
Diffusion barrierCopperSiliconMaterials scienceScanning electron microscopeAnalytical Chemistry (journal)Substrate (aquarium)Thin filmTransmission electron microscopyElectroplatingBarrier layerCrystallographyDiffusionNanotechnologyMetallurgyChemistryLayer (electronics)Composite materialGeologyOceanographyChromatographyThermodynamicsPhysicsSemiconductor materials and interfacesCopper Interconnects and ReliabilityElectronic Packaging and Soldering Technologies