Ultrasonic soldering silica glass and 2024 alloy in low temperature
Ruixiang Yi, Chao Chen, Haijun Li, Yibo Ma
Abstract
Sn–9Zn–2Al solder alloy was used to weld silica glass and 2024 aluminium alloy with the assistance of ultrasonic wave. It can be concluded from the results that a good metallurgical bond can be formed between silica glass and 2024 aluminium alloy. The effects of different experimental parameters on the properties and morphology of soldering joints were discussed. In the use of ultrasound assisted conditions, the Al–Zn–Sn solution layer was generated on the side of the Sn–Zn–Al solder alloy and 2024 aluminium alloy due to atomic diffusion. In addition, there was an oxide layer between the solid solution layer and the solder alloy. The reason is that Al atoms can combine with O atoms under the action of ultrasonic wave, and the deposition reaction occurs to form an alumina layer. Finally, the interface structure of the soldering joint is silica glass/Sn–Zn eutectic phase, α-Al phase, β-Zn phase/Al 2 O 3 oxide layer/Al–Zn–Sn solution layer/2024 aluminium alloy.