Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding
Minghui Zhang, Li‐Yin Gao, Yu-Xi Wang, Wei Dong, Ning Zhao, Zhi‐Quan Liu
Topics & Concepts
Materials scienceInterconnectionDirect bondingSolderingAnodic bondingWire bondingThermocompression bondingChemical-mechanical planarizationComposite materialPolishingMetallurgyNanotechnologySiliconChipLayer (electronics)Electrical engineeringComputer scienceComputer networkEngineering3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesNanofabrication and Lithography Techniques