The synergistic effects of additives on the micro vias copper filling
Zhihua Tao, Zhiyuan Long, Linjie Tengxu, Guanting Liu, Xuefei Tao
Topics & Concepts
ChemistryCopperChemical engineeringOrganic chemistryEngineeringElectrodeposition and Electroless CoatingsNanofabrication and Lithography TechniquesSemiconductor materials and devices