Assembly and Reliability of Lead-Free Solder Joints
John H. Lau, Ning-Cheng Lee
Topics & Concepts
SolderingReliability (semiconductor)Lead (geology)Reliability engineeringMaterials scienceForensic engineeringMetallurgyEngineeringGeologyPhysicsGeomorphologyQuantum mechanicsPower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesEngineering and Materials Science Studies