Litcius/Paper detail

Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing

Song Yuan, Xiaoguang Guo, Shengtong Liu, Penghui Li, Fumin Liu, Lemin Zhang, Renke Kang

2022Materials Science in Semiconductor Processing22 citationsDOI

Topics & Concepts

ScratchingMaterials scienceAbrasiveScratchSiliconGrindingSubstrate (aquarium)Composite materialNano-NanotechnologyMetallurgyGeologyOceanographyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research
Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing | Litcius